Polyimide precursor solution composition

A first polyimide precursor solution composition contains: (A) a polyamic acid; (B) a carboxylic acid compound having at least three pairs of carboxyl groups within its molecule or an esterified product thereof; and (D) a solvent. A second polyimide precursor solution composition contains the compon...

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Bibliographische Detailangaben
Hauptverfasser:	HIRANO TETSUJI, KIDOSAKI TORU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A first polyimide precursor solution composition contains: (A) a polyamic acid; (B) a carboxylic acid compound having at least three pairs of carboxyl groups within its molecule or an esterified product thereof; and (D) a solvent. A second polyimide precursor solution composition contains the components (A), (B), and (D) of the first polyimide precursor solution composition and additionally containing (C) a carboxylic acid compound having two pairs of carboxyl groups within its molecule or an esterified product thereof. A third polyimide precursor solution composition contains the components of the second polyimide precursor solution composition, wherein the polyamic acid (A) is a polyamic acid having a specific structure.