Semiconductor bump-bonded X-ray imaging device
A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
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| creator | NYKANEN HENRI TAPIO LAHTINEN TUOMAS HEIKKI ELMERI LIN LIMIN SPARTIOTIS KONSTANTINOS LAUKKA PASI JUHANI |
| description | A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds. |
| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS DIAGNOSIS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION MEASUREMENT OF NUCLEAR OR X-RADIATION MEASURING MEDICAL OR VETERINARY SCIENCE PHYSICS SEMICONDUCTOR DEVICES SURGERY TESTING |
| title | Semiconductor bump-bonded X-ray imaging device |
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