Semiconductor bump-bonded X-ray imaging device

A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.

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Bibliographische Detailangaben
Hauptverfasser:	NYKANEN HENRI TAPIO, LAHTINEN TUOMAS HEIKKI ELMERI, LIN LIMIN, SPARTIOTIS KONSTANTINOS, LAUKKA PASI JUHANI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DIAGNOSIS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION MEASUREMENT OF NUCLEAR OR X-RADIATION MEASURING MEDICAL OR VETERINARY SCIENCE PHYSICS SEMICONDUCTOR DEVICES SURGERY TESTING
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Beschreibung
Zusammenfassung:	A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.