Solder attach apparatus and method

An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more elec...

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Bibliographische Detailangaben
1. Verfasser:	MIRPURI KABIRKUMAR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.