Ball grid array configuration for reliable testing

A semiconductor die with an array of contacts, where at least two contacts in adjacent positions have the same data signal during testing operations with a test probe. The adjacent contacts of the cluster allow the use of a larger test probe tip and/or greater tolerance on test probe tip alignment d...

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Bibliographische Detailangaben
Hauptverfasser: TORREITER OTTO A, WENDEL DIETER
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor die with an array of contacts, where at least two contacts in adjacent positions have the same data signal during testing operations with a test probe. The adjacent contacts of the cluster allow the use of a larger test probe tip and/or greater tolerance on test probe tip alignment during testing operations.