Variable temperature solders for multi-chip module packaging and repackaging

Various methods of mounting semiconductor chips on a substrate are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first plurality of solder interconnect structures to a first semiconductor chip. The first solder interconnect structures have a first melting p...

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Bibliographische Detailangaben

1. Verfasser:	EPPES DAVID H
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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