Variable temperature solders for multi-chip module packaging and repackaging

Various methods of mounting semiconductor chips on a substrate are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first plurality of solder interconnect structures to a first semiconductor chip. The first solder interconnect structures have a first melting point. The first semiconductor chip may be tested. If the first semiconductor chip passes the testing, then a second semiconductor chip is coupled to the first semiconductor chip using a second plurality of solder interconnect structures that have a second melting point lower than the first melting point.