RFID tag assembly methods

RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna suc...

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Bibliographische Detailangaben
Hauptverfasser: KOEPP RONALD L, COLLERAN WILLIAM T, MA YANJUN, OLIVER RONALD A, MORETTI VINCENT C, FASSETT JAY M
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.