Semiconductor device with combined power and ground ring structure

A semiconductor device includes a lead frame, and an integrated circuit die. The lead frame has a flag for supporting the die and leads that surround that flag and die. The lead frame also has ground ring that surrounds the flag and die. First bond wires electrically connect the die to the lead fram...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IBRAHIM RUZAINI B, TIU KONG BEE, KOH WEN SHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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