Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer

An apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer are provided. The apparatus comprises a multi-wavelength light source, a semiconductor wafer holder for holding a semiconductor wafer, a head for directing th...

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1. Verfasser: SCHÖNLEBER MARTIN
Format: Patent
Sprache:eng
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