Low temperature hot melt adhesives for disposable articles with high creep resistance

The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufactu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	XENIDOU MARIA, HU YUHONG
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers.