Wiring substrate, multi-piece wiring substrate, and method for manufacturing same

A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surfac...

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Bibliographische Detailangaben
Hauptverfasser:	HIRAYAMA SATOSHI, HASEGAWA MASAMI, KITO NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.