Mounting components in electronic devices

An electronic device comprises electronic circuitry and a molded plastic covering (5). In order to prevent ingress of water and dust, a hermetic seal is provided between the covering (5) and components that are accessible through the covering (5), such as a socket (7) or display, or components such...

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Bibliographische Detailangaben
Hauptverfasser:	LASAROV HARRI AUKUSTI, WIBERG TITTA-VIRVA JUULIA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PUBLIC ADDRESS SYSTEMS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TELEPHONIC COMMUNICATION TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An electronic device comprises electronic circuitry and a molded plastic covering (5). In order to prevent ingress of water and dust, a hermetic seal is provided between the covering (5) and components that are accessible through the covering (5), such as a socket (7) or display, or components such as electrical connections (9). The components (7, 9) are at least partially coated in a coating material 15, such as a thermally activated polyurethane adhesive or thin thermoplastic, to provide a strong bond to the covering (5) that does not require the use of solder. The device may be a wearable device in which waterproof sealing is required.