Low profile heat spreader and methods
Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die.
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die. |
---|