System in package structure, electroplating module thereof and memory storage device

A system in package (SIP) structure, an electroplating module thereof and a memory storage device are provided. The SIP structure includes a first layout layer, a second layout layer and a rewritable non-volatile memory module. The first layout layer includes a first pad and a wire. The first pad is...

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Bibliographische Detailangaben
Hauptverfasser:	LEE CHUN-FENG, CHANG CHIEN-LIANG, CHENG HSUAN-TENG
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CALCULATING CHEMISTRY COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HANDLING RECORD CARRIERS INFORMATION STORAGE METALLURGY PHYSICS PRESENTATION OF DATA PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES STATIC STORES
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Beschreibung
Zusammenfassung:	A system in package (SIP) structure, an electroplating module thereof and a memory storage device are provided. The SIP structure includes a first layout layer, a second layout layer and a rewritable non-volatile memory module. The first layout layer includes a first pad and a wire. The first pad is close to a first side of the first layout layer, and the first pad is configured to couple to a ground voltage. One terminal of the wire is coupled to the first pad, and another terminal of the wire is coupled to an opening of the SIP structure, wherein the opening is located at a second side of the first layout layer opposite to the first side, and the opening is configured to couple to an external voltage.