Temporary liquid thermal interface material for surface tension adhesion and thermal control

Temporary liquid thermal interface material for surface tension adhesion and thermal control

An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetwe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GUERIN LUC, KNOX MARC D, WHITEHEAD STEVE, TRUONG VAN T, LAWSON GEORGE J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.