Part being centered during assembly process, wafer level parts assembly, and apparatus and method to manufacture wafer level parts assembly

Part being centered during assembly process, wafer level parts assembly, and apparatus and method to manufacture wafer level parts assembly

A part to be centered during an assembly process includes an effective portion which performs a function and is shaped for insertion into a hole, a reference portion extended from the effective portion and formed substantially perpendicular to a center axis of the effective portion, and an aligning...

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Bibliographische Detailangaben
Hauptverfasser: CHOI MIN-SEOG, LEE EUN-SUNG
Format: Patent
Sprache:eng
Schlagworte:
COMBINED OPERATIONS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PHYSICS
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:A part to be centered during an assembly process includes an effective portion which performs a function and is shaped for insertion into a hole, a reference portion extended from the effective portion and formed substantially perpendicular to a center axis of the effective portion, and an aligning portion extended from the effective portion and formed around the effective portion. When the effective portion of the part is inserted into the hole, a center of the effective portion is automatically aligned with a centerline of the hole.