Dual side staggered surface mount dual in-line memory module

Dual side staggered surface mount dual in-line memory module

Embodiments of the invention relates to a process and assembly for a dual sided and staggered connector arrangement on a substrate. Surface mount connector technology is employed to enable a flush connection of connector leads to the surface of the substrate. Retaining pins are provided with each co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PYMENTO LARRY G, SASS TONY C
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments of the invention relates to a process and assembly for a dual sided and staggered connector arrangement on a substrate. Surface mount connector technology is employed to enable a flush connection of connector leads to the surface of the substrate. Retaining pins are provided with each connector and are sized to be received by the substrate, but not to extend through the substrate. The retaining pins are sized and configured to hold each connector in a set position, while mitigating interference with an opposing side of the PCB.