Hybrid interconnect
A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a fi...
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creator | FINKMAN SHAI NAVVE ADI |
description | A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit. |
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The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; DIAGNOSIS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HUMAN NECESSITIES ; HYGIENE ; IDENTIFICATION ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEDICAL OR VETERINARY SCIENCE ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SURGERY</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160209&DB=EPODOC&CC=US&NR=9257763B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160209&DB=EPODOC&CC=US&NR=9257763B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FINKMAN SHAI</creatorcontrib><creatorcontrib>NAVVE ADI</creatorcontrib><title>Hybrid interconnect</title><description>A connector for connection to terminals of an integrated circuit. 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The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>DIAGNOSIS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HUMAN NECESSITIES</subject><subject>HYGIENE</subject><subject>IDENTIFICATION</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEDICAL OR VETERINARY SCIENCE</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURGERY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD2qEwqykxRyMwrSS1Kzs_LS00u4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8aHBlkam5uZmxk5GxkQoAQD8BCBo</recordid><startdate>20160209</startdate><enddate>20160209</enddate><creator>FINKMAN SHAI</creator><creator>NAVVE ADI</creator><scope>EVB</scope></search><sort><creationdate>20160209</creationdate><title>Hybrid interconnect</title><author>FINKMAN SHAI ; NAVVE ADI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9257763B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>DIAGNOSIS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HUMAN NECESSITIES</topic><topic>HYGIENE</topic><topic>IDENTIFICATION</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEDICAL OR VETERINARY SCIENCE</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURGERY</topic><toplevel>online_resources</toplevel><creatorcontrib>FINKMAN SHAI</creatorcontrib><creatorcontrib>NAVVE ADI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FINKMAN SHAI</au><au>NAVVE ADI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Hybrid interconnect</title><date>2016-02-09</date><risdate>2016</risdate><abstract>A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS DIAGNOSIS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEDICAL OR VETERINARY SCIENCE PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURGERY |
title | Hybrid interconnect |
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