Hybrid interconnect

A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a fi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FINKMAN SHAI, NAVVE ADI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS DIAGNOSIS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEDICAL OR VETERINARY SCIENCE PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURGERY
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Beschreibung
Zusammenfassung:	A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.