Method for assembling a circuit carrier with a housing component, and optical unit

The present invention relates to a method for assembling a circuit carrier with a housing component and furthermore to an optical unit for emitting and/or receiving radiation that is fabricated using this particular method of assembling and aligning the circuit carrier with the housing component. Th...

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Bibliographische Detailangaben
Hauptverfasser:	HARDEGGER MARTIN, SCHULZE HENRY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PRINTED CIRCUITS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The present invention relates to a method for assembling a circuit carrier with a housing component and furthermore to an optical unit for emitting and/or receiving radiation that is fabricated using this particular method of assembling and aligning the circuit carrier with the housing component. The method comprises the following steps: providing said circuit carrier, wherein on said circuit carrier there is arranged at least one electronic component, and providing said housing component having at least one first opening; aligning said circuit carrier in a way that said electronic component is aligned with respect to said first opening in the housing component, wherein the electronic component is directly used as a fiducial for its own position on the circuit carrier; fixing the circuit carrier at the housing component.