Reducing source contact to gate spacing to decrease transistor pitch

Methods and structures for transistors having reduced source contact to gate spacings in semiconductor devices are disclosed. In one embodiment, a method of forming a transistor can include: forming a gate over an active area of the transistor; forming source and drain regions aligned to the gate in...

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Hauptverfasser: LEE WINSTON, WEI CHIENUAN, WU ALBERT, SUTARDJA PANTAS, CHANG RUNZI, LEE PETER
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creator LEE WINSTON
WEI CHIENUAN
WU ALBERT
SUTARDJA PANTAS
CHANG RUNZI
LEE PETER
description Methods and structures for transistors having reduced source contact to gate spacings in semiconductor devices are disclosed. In one embodiment, a method of forming a transistor can include: forming a gate over an active area of the transistor; forming source and drain regions aligned to the gate in the active area; forming source and drain contacts over the source and drain regions, where a spacing from the gate to the source contact of the transistor is less than a spacing from the gate to the drain contact of the transistor; and using one or more modified masks for forming doping profiles for the source region and the drain region.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Reducing source contact to gate spacing to decrease transistor pitch
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