Reducing source contact to gate spacing to decrease transistor pitch

Methods and structures for transistors having reduced source contact to gate spacings in semiconductor devices are disclosed. In one embodiment, a method of forming a transistor can include: forming a gate over an active area of the transistor; forming source and drain regions aligned to the gate in...

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Bibliographische Detailangaben
Hauptverfasser: LEE WINSTON, WEI CHIENUAN, WU ALBERT, SUTARDJA PANTAS, CHANG RUNZI, LEE PETER
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Methods and structures for transistors having reduced source contact to gate spacings in semiconductor devices are disclosed. In one embodiment, a method of forming a transistor can include: forming a gate over an active area of the transistor; forming source and drain regions aligned to the gate in the active area; forming source and drain contacts over the source and drain regions, where a spacing from the gate to the source contact of the transistor is less than a spacing from the gate to the drain contact of the transistor; and using one or more modified masks for forming doping profiles for the source region and the drain region.