Method for producing bonded body

A method for producing a bonded body of ceramic and metal bodies includes stacking a ceramic body, metal body, gap layer capable of preventing oxidation and hindering heat conduction, first intermediate layer and second intermediate layer with the gap layer between the ceramic body and the metal bod...

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Bibliographische Detailangaben
Hauptverfasser:	OOKOUCHI YASUYUKI, KAWAMOTO YASUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CEMENTS CERAMICS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIME, MAGNESIA MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL REFRACTORIES SEPARATION SLAG SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF NATURAL STONE WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for producing a bonded body of ceramic and metal bodies includes stacking a ceramic body, metal body, gap layer capable of preventing oxidation and hindering heat conduction, first intermediate layer and second intermediate layer with the gap layer between the ceramic body and the metal body in the stacking direction. The first intermediate layer is between the ceramic body and gap layer, and the second intermediate layer is between the gap layer and metal body, linear expansion coefficients of the first and second intermediate layers being between those of the ceramic body and the metal body. Diffusion bonding is performed between the ceramic body and the first intermediate layer, and between the metal body and the second intermediate layer simultaneously. The gap layer is then removed from between the first and second intermediate layers. The first and second intermediate layers are then bonded to each other.