Printed circuit board with reduced emission of electro-magnetic radiation

A printed circuit board including a first outer layer, a second outer layer and an integrated circuit mounted on the second outer layer. The integrated circuit has a single exposed pad electrically connected to a ground reference, a first supply pin electrically connected to a first power supply and...

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Bibliographische Detailangaben
Hauptverfasser:	MOSELEY RICHARD, EDGINGTON GREGORY, BHATT PIYUSH, ROTIGNI MARIO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A printed circuit board including a first outer layer, a second outer layer and an integrated circuit mounted on the second outer layer. The integrated circuit has a single exposed pad electrically connected to a ground reference, a first supply pin electrically connected to a first power supply and a second supply pin electrically connected to a second power supply, wherein the first power supply is configured to generate a first supply current with frequency components higher than the frequency components of a second supply current generated by the second power supply.