Ball grid array configuration for reliable testing
A method of testing a semiconductor die having an array of contacts, where at least two I/O pads in adjacent positions have the same data signal during testing operations with a test probe. The adjacent I/O pads form a test cluster allowing the use of a larger test probe tip and/or greater tolerance...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A method of testing a semiconductor die having an array of contacts, where at least two I/O pads in adjacent positions have the same data signal during testing operations with a test probe. The adjacent I/O pads form a test cluster allowing the use of a larger test probe tip and/or greater tolerance on test probe tip alignment during testing operations. |
|---|