Explosion-protected semiconductor module

Explosion-protected semiconductor module

A semiconductor module has a carrier, a semiconductor chip mounted on the carrier, a bond wire, a module housing, and a first sound absorber. The module housing has a housing side wall. The bond wire is arranged in the module housing. At least a section of the first sound absorber is arranged betwee...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOHLFELD OLAF, BOENIG GUIDO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor module has a carrier, a semiconductor chip mounted on the carrier, a bond wire, a module housing, and a first sound absorber. The module housing has a housing side wall. The bond wire is arranged in the module housing. At least a section of the first sound absorber is arranged between the semiconductor chip and the housing side wall.