High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink

High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink

A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAN KHENG LENG, LEE CHAIU JIN, NG KEAT CHUAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.