Optimized fan duty control for computing device

Embodiments generally relate to thermal management in a computing device. The present technology discloses techniques that can enable an effective and reliable control of a fan speed using various factors such as a power loading value provided by a power supply unit. Power loading values can indicat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN CHAO-JUNG, CHEN YIIEH
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Embodiments generally relate to thermal management in a computing device. The present technology discloses techniques that can enable an effective and reliable control of a fan speed using various factors such as a power loading value provided by a power supply unit. Power loading values can indicate a level of current flowing through the device, which is generally proportional to the amount of heat dissipated by such device.