Micromechanical component having a bond joint

Micromechanical component having a bond joint

A micromechanical component includes a substrate and a first oxide layer on the substrate, the first oxide layer having an aperture. The component further includes a conductive functional layer, which is provided on the first oxide layer in the region of the aperture, and a metal layer, which is pro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BAER HANS-PETER, STAHL HEIKO, DUENN CHRISTOPH
Format: Patent
Sprache:eng
Schlagworte:
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:A micromechanical component includes a substrate and a first oxide layer on the substrate, the first oxide layer having an aperture. The component further includes a conductive functional layer, which is provided on the first oxide layer in the region of the aperture, and a metal layer, which is provided on the functional layer, for producing a bond joint. A second oxide layer is provided on lateral faces of the functional layer for insulating the functional layer.