Integrated circuit protection and ruggedization coatings and methods
An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component. |
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