Liquid ejection head and method for manufacturing liquid ejection head

A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher t...

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Bibliographische Detailangaben
Hauptverfasser:	TAGAWA YOSHINORI, YAMAMURO JUN, KOMIYAMA HIROTO, SUJAKU SHIRO, HASEGAWA KOUJI, IBE SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.