Semiconductor device with twisted leads

A lead frame for a semiconductor device has a die flag and leads that surround the die flag. In order to decrease the distance or spacing between inner lead ends and the die flag, which allows for short bond wires for connecting the inner lead ends to a die mounted on the die flag, at least some of the leads are twisted along their lengths to be angled with respect to a die-flag plane. The pitch between such twisted leads can be reduced without resulting in physical contact between adjacent leads, enabling the leads to extend further towards the die flag.