Defect inspection method and defect inspection device

A defect inspection method for inspecting a defect on a semiconductor wafer, using plural inspection methods includes: merging hot-spot coordinates as coordinates on the semiconductor wafer, designated by a user, or coordinates where a systematic defect can occur, with detected defect coordinates on...

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Bibliographische Detailangaben
Hauptverfasser:	FUKUNAGA FUMIHIKO, HARADA MINORU, MIYAMOTO ATSUSHI, HIRAI TAKEHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A defect inspection method for inspecting a defect on a semiconductor wafer, using plural inspection methods includes: merging hot-spot coordinates as coordinates on the semiconductor wafer, designated by a user, or coordinates where a systematic defect can occur, with detected defect coordinates on the semiconductor wafer, acquired from inspection information, after information indicating the type of coordinates are added thereto; deciding an inspection sequence of the coordinates merged with each other; and defect inspection for executing selection using the information indicating the respective types of the coordinates merged with each other, and executing an inspection by selecting an inspection method for every coordinates to be inspected.