Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same
A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in co...
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| creator | KOYAMA MASAYOSHI KOMYOJI DAIDO TSUKAHARA NORIHITO |
| description | A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object. |
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APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; METERING BY VOLUME ; PERFORMING OPERATIONS ; PHYSICS ; PRINTED CIRCUITS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SOLDERING OR UNSOLDERING ; SPRAYING OR ATOMISING IN GENERAL ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TESTING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151020&DB=EPODOC&CC=US&NR=9162249B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151020&DB=EPODOC&CC=US&NR=9162249B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOYAMA MASAYOSHI</creatorcontrib><creatorcontrib>KOMYOJI DAIDO</creatorcontrib><creatorcontrib>TSUKAHARA NORIHITO</creatorcontrib><title>Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same</title><description>A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>METERING BY VOLUME</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi0EKwlAMRLtxIeodcgEXVhG6VRSXgrouoU1t4Dc__kTEnl5aegBXw8x7M89eVzQnqNmUxChBExOgaviyPEFHWEVxZBmGhkOgZPC2oUns-0DwYW9BWQClHr9coXMU6MjbWE-ytwSGHS2zWYPBaDXlIoPz6X68rEljSaZYkZCXj1ux2ef5rjjk2z-UH3KgQ_k</recordid><startdate>20151020</startdate><enddate>20151020</enddate><creator>KOYAMA MASAYOSHI</creator><creator>KOMYOJI DAIDO</creator><creator>TSUKAHARA NORIHITO</creator><scope>EVB</scope></search><sort><creationdate>20151020</creationdate><title>Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same</title><author>KOYAMA MASAYOSHI ; KOMYOJI DAIDO ; TSUKAHARA NORIHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9162249B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>METERING BY VOLUME</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KOYAMA MASAYOSHI</creatorcontrib><creatorcontrib>KOMYOJI DAIDO</creatorcontrib><creatorcontrib>TSUKAHARA NORIHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOYAMA MASAYOSHI</au><au>KOMYOJI DAIDO</au><au>TSUKAHARA NORIHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same</title><date>2015-10-20</date><risdate>2015</risdate><abstract>A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY METERING BY VOLUME PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SOLDERING OR UNSOLDERING SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same |
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