Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same

A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in co...

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Bibliographische Detailangaben
Hauptverfasser:	KOYAMA MASAYOSHI, KOMYOJI DAIDO, TSUKAHARA NORIHITO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY METERING BY VOLUME PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SOLDERING OR UNSOLDERING SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.