Integrated circuit device, system, and method of fabrication

A semiconductor device (10), comprising a first semiconductor portion (32) having a first end (34), a second end (36), and a slit portion (30), wherein the width of the slit portion (30) is less than the width of at least one of the first end (34) and the second end (36); a second portion (38) that...

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Bibliographische Detailangaben
1. Verfasser:	MALY WOJCIECH P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device (10), comprising a first semiconductor portion (32) having a first end (34), a second end (36), and a slit portion (30), wherein the width of the slit portion (30) is less than the width of at least one of the first end (34) and the second end (36); a second portion (38) that is a different material than the first semiconductor portion (32), a third portion (40) that is a different material than the first semiconductor portion (32), wherein the second (38) and third (40) portions are on opposite sides of the slit portion (30), and at least three terminals selected from a group consisting of a first terminal (12) connected to the first end (34), a second terminal (14) connected to the second end (36), a third terminal (16) connected to the second portion (38), and a fourth terminal (17) connected to the third portion (40).