Semiconductor package with improved testability

An exemplary implementation of the present disclosure includes a testable semiconductor package that includes an active die having interface contacts and dedicated testing contacts. An interposer is situated adjacent a bottom surface of the active die, the interposer providing electrical connections...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HU KEVIN KUNZHONG, VORENKAMP PIETER, ZHAO SAM ZIQUN, KHAN REZAUR RAHMAN, CHEN XIANGDONG, KARIKALAN SAMPATH K. V
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An exemplary implementation of the present disclosure includes a testable semiconductor package that includes an active die having interface contacts and dedicated testing contacts. An interposer is situated adjacent a bottom surface of the active die, the interposer providing electrical connections between the interface contacts and a bottom surface of the testable semiconductor package. At least one conductive medium provides electrical connection between at least one of the dedicated testing contacts and a top surface of the testable semiconductor package. The at least one conductive medium can be coupled to a package-top testing connection, which may include a solder ball.