Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof

Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof

An integrated circuit packaging system including: a fiber-less organic substrate including: a first dielectric layer, a first metal layer on the first dielectric layer, a second dielectric layer on the first dielectric layer and the first metal layer, and an interconnect via plated on the first meta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TRASPORTO ARNEL SENOSA, DO BYUNG TAI, KIM SUNG SOO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit packaging system including: a fiber-less organic substrate including: a first dielectric layer, a first metal layer on the first dielectric layer, a second dielectric layer on the first dielectric layer and the first metal layer, and an interconnect via plated on the first metal layer and the second dielectric layer; an integrated circuit mounted over the second dielectric layer; and an integrated circuit interconnect between the integrated circuit and the interconnect via.