Closed-loop control for improved polishing pad profiles

Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thick...

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Bibliographische Detailangaben
Hauptverfasser: DHANDAPANI SIVAKUMAR, TSAI STAN D, FUNG JASON G, MENK GREGORY E, COCCA CHRISTOPHER D, CHANG SHOU-SUNG, GARRETSON CHARLES C, QIAN JUN
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.