Bonding alignment tool and method

An apparatus is disclosed for detecting flag velocity during a eutectic process for bonding two wafers. The apparatus includes a plurality of sensors for detecting a time and/or velocity of a plurality of flags within a flag-out mechanism. The apparatus also includes one or more displays displaying...

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Bibliographische Detailangaben
Hauptverfasser:	WANG I-SHI, LIN JENG-HAO, SHIH YUN-TAI, SU CHING-HOU, NI CHYI-TSONG, PAN KUAN-MING, TSAI WUN-KAI, CHO JUI-MU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus is disclosed for detecting flag velocity during a eutectic process for bonding two wafers. The apparatus includes a plurality of sensors for detecting a time and/or velocity of a plurality of flags within a flag-out mechanism. The apparatus also includes one or more displays displaying time durations associated with the movement of the flags during the bonding process. Also disclosed is a method of aligning wafers in a eutectic bonding process. The method includes determining one or more time durations associated with the movement of the flags in the plurality of flags. The method also includes determining if a misalignment has occurred based on the one or more time durations associated with the movement of the flags.