Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor

A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of...

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Hauptverfasser: AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, SAKAI KIYOSHI, TAJIMA AKIO
Format: Patent
Sprache:eng
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Zusammenfassung:A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0 a 3.5, 0 b 3.5, and 0 c 1 are obtained, and also a+b+2c=4 is obtained: