Semiconductor device and method of manufacturing the same

A semiconductor device includes a first semiconductor package including a first mold part, a second semiconductor package including a second mold part, a connecting pattern configured to electrically connect the first and second semiconductor packages to each other, and a molding pattern between the...

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Hauptverfasser:	LEE SEOKWON, KIM HYUNKI, SHIM JONGBO, HONG JISUN, CHOI KYOUNGSEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	LEE SEOKWON KIM HYUNKI SHIM JONGBO HONG JISUN CHOI KYOUNGSEI
description	A semiconductor device includes a first semiconductor package including a first mold part, a second semiconductor package including a second mold part, a connecting pattern configured to electrically connect the first and second semiconductor packages to each other, and a molding pattern between the first and second semiconductor packages. The molding pattern extends to cover at least a portion of a sidewall of only the second semiconductor package.
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title	Semiconductor device and method of manufacturing the same
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