Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

A semiconductor device includes a first semiconductor package including a first mold part, a second semiconductor package including a second mold part, a connecting pattern configured to electrically connect the first and second semiconductor packages to each other, and a molding pattern between the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE SEOKWON, KIM HYUNKI, SHIM JONGBO, HONG JISUN, CHOI KYOUNGSEI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device includes a first semiconductor package including a first mold part, a second semiconductor package including a second mold part, a connecting pattern configured to electrically connect the first and second semiconductor packages to each other, and a molding pattern between the first and second semiconductor packages. The molding pattern extends to cover at least a portion of a sidewall of only the second semiconductor package.