System in a package (SiP)
A system in a package (SiP) includes a first semiconductor die having a nonvolatile memory and trim/repair circuitry, and a second semiconductor die having a volatile memory and trim/repair circuitry. The first and the second semiconductor die are in a same package. The nonvolatile memory of the fir...
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| Sprache: | eng |
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| Zusammenfassung: | A system in a package (SiP) includes a first semiconductor die having a nonvolatile memory and trim/repair circuitry, and a second semiconductor die having a volatile memory and trim/repair circuitry. The first and the second semiconductor die are in a same package. The nonvolatile memory of the first semiconductor die is configured to store trim/repair values for each of the first and the second semiconductor die. The trim/repair circuitries of the first and second semiconductor die are configured to, in response to a reset of the second semiconductor die, copy the trim/repair values from the nonvolatile memory of the first semiconductor die to the volatile memory of the second semiconductor die. |
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