Above motherboard interposer with quarter wavelength electrical paths

A computing device has a circuit substrate having a socket, a main processor inserted into the socket, an interposer substrate inserted between the socket and the main processor, the circuit substrate, the socket and the interposer substrate being electrically connected, and peripheral circuit modul...

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Bibliographische Detailangaben
Hauptverfasser: JOHNSON MORGAN, WEISS FREDERICK G
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A computing device has a circuit substrate having a socket, a main processor inserted into the socket, an interposer substrate inserted between the socket and the main processor, the circuit substrate, the socket and the interposer substrate being electrically connected, and peripheral circuit modules residing on the interposer substrate, wherein each peripheral circuit module has an electrical path having a path length to the main processor less than one-quarter of a wavelength of signals that will travel the electrical path.