Reduction in modulus of polyurethane sealants and adhesives

Low modulus, polyurethane sealant or adhesive compositions and a method of reducing the modulus of a polyurethane sealant or adhesive composition, including adding a modulus reducing additive of at least one of rosin esters, hydrogenated rosin esters, or mixtures thereof, to a sealant or adhesive co...

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Bibliographische Detailangaben
Hauptverfasser:	FERENZ ROBERT LOUIS, KNOLL PATRICK, WYMER ERIC S, VARKEY JYOTHI THAZHAKUZHY
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Low modulus, polyurethane sealant or adhesive compositions and a method of reducing the modulus of a polyurethane sealant or adhesive composition, including adding a modulus reducing additive of at least one of rosin esters, hydrogenated rosin esters, or mixtures thereof, to a sealant or adhesive composition including a polyurethane prepolymer, optionally having a bio-based content of from about 15% to about 75% by weight.