Integrated circuit package with stand-off legs

Provided is a lead frame package with stand-off legs to prevent the die attach pad (DAP), which is part of the package substrate, to tilt or shift from its original position during the molding process. Also provided are methods for assembling such lead frame packages into various integrated circuit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN PING CHET, LIM KEN BENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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