Integrated circuit package with stand-off legs
Provided is a lead frame package with stand-off legs to prevent the die attach pad (DAP), which is part of the package substrate, to tilt or shift from its original position during the molding process. Also provided are methods for assembling such lead frame packages into various integrated circuit...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Provided is a lead frame package with stand-off legs to prevent the die attach pad (DAP), which is part of the package substrate, to tilt or shift from its original position during the molding process. Also provided are methods for assembling such lead frame packages into various integrated circuit (IC) packages. Compared to conventional lead frame packages without stand-off legs, the lead frame packages of the present invention have less aesthetic and functional defects, thereby leading to an increase in product reliability and yield. |
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