Method of forming an integrated electromechanical relay

A method is provided to form an electromechanical relay. A magnetic layer is etched to form a substrate-metal structure having a pattern of conductive contacts. The substrate-metal structure is electroplated. The electroplated structure is attached to a printed circuit board (PCB). A portion of the electroplated structure is removed to electrically decouple the conductive contacts. The PCB includes a common contact terminal aligned to one end of each conductive contact. The PCB includes magnetic actuators each having a magnetic core with a first core part disposed within a via extending through layers of the PCB, and an electrical coil disposed around the first core part within layers of the PCB. Each conductive contact is aligned to an associated magnetic actuator to enable electrical contact between the common contact terminal and the conductive contact upon activation of the associated magnetic actuator.